DiagnoSYS Group


Press Release . . . . . .

23 December 2004 DiagnoSYS and Auto Tronik introduce the BS383, the most advanced low volume bench top Pick and Place solution yet!

Targeting low volume production requirements the BS383 is designed to meet the demands of today's cost conscious world. When the quality of a board and speed of manufacture cannot be sacrificed the BS383 is equipped to meet these rigors. With highly accurate placement being of equal importance on low or high volume assemblies, the BS383 pick and place system offers accurate placement of all components as low as 0.5mm pitch. With on the fly vision alignment accurate placement of 0201, SOIC, PLCC, BGA, BGA and QFP packages at up to 3600 components per hour can be achieved.

Repeatability of placement accuracy is achieved with servo motor control and combined with vision alignment, offers placement accuracy to 0.1mm. An upward camera can further increase placement accuracy to 0.05mm, essential when placing QFP, BGA, BGA and CSP packaged devices. Smart feeder technology offers up to 88 feeders, delivering tube or taped components and 2 trays for waffle tray components. Smart feeders deliver trouble free, easy operation and superior set up rates with correct part confidence. The Flexible Fiducial Mark System (FFMS) adds flexibility allowing circular and square pads or plated through holes to be used to lock placement positions during set up as well as correcting for positional differences when boards are cycled during a run of boards. Importing CAD with the CAD Conversion software completes the fast and easy board set up before production, all in a familiar Windows environment. The BS383 is just one pick and place system in a range of pick and place, stencil printers, reflow ovens and Automated Optical Inspection systems available from DiagnoSYS.

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